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mlx90616esf - hca infra red thermometer in to - 39 for high temperature thermometer guns 3901090616 page 1 of 36 data s heet rev 002 august 20, 2012 features and benefits ? easy to integrate ? factory calibrated in wide temperature range - 40 + 85 ?c for sensor temperature ? measurement range - 70 c to 1030 c ? measurement resolution of 0.0 2 c ? buil t in thermal gradient compensation sensor for fast , stable readin gs ? smbus compatible digital interface ? customizable pwm output for continuous reading ? 3v supply voltage ; ? sleep mode for reduced power consumption ? 8 - 14um spectral sensitivity applications examples ? sensor element for high temperature thermometer guns orde ring information part no. temperature code package code - option code standard part pack ing form mlx90616 e:( - 40 ? c to 85 ? c) sf (to - 39) - x x x (1) (2) (3) - 000 - tu (1) supply voltage/ accuracy h - 3v , no ir calibration (2) number of the rmopiles c C gradient compensated : see page 2 (3) package options: a C standard package example: mlx9061 6 esf - hc a - 000 - tu 1 functional diagram figure 1 : typical application schematics 2 gen eral description the mlx9061 6 is an infra red thermopile sensor for high temperature non - contact thermometers . both the ir sensitive thermopile detector chip and the signal conditioning assp are integrated in the same to - 39 can. a low noise amplifier, 17 - bit adc and powerful dsp unit, result in a high accuracy and resolution of the thermometer . the ambient temperature sensor in the mlx90616 is calibrated in the factory . the digital interface of the sensor is smbus compatible. the mlx90616 is intende d to be used in applications where the user places a lens in front of the sensor to adjust the fov to his application. the sensor - lens combination temperature measurement has to be calibrated by the customer . melexis provides the necessary so f tware to do this in an engineering controlled environment. the mlx90616 consists of a chipset developed and manufactured by melexis: ? the infra red thermopile detector mlx81101 ? the signal conditioning assp mlx90302, specially designed to process the output of ir sen sor. the device is available in an industry standard to - 39 package. j1 con1 scl sda gnd vdd u1 mlx90616 1 pwm sda c1 mlx90616 connection to smbus 4 vss scl 3 2 vdd 0.1uf
mlx90616esf - hca infra red thermometer in to - 39 for high temperature thermometer guns 3901090616 page 2 of 36 data s heet rev 002 august 20, 2012 general description (continued) an optical filter (long - wave pass) that cuts off the visible and near infra - red radiant flux is integrated in the package to provide ambient and sunlig ht immunity. the wavelength pass band of this optical filter is between 8 and 14 m. a low noise amplifier, high resolution 17 - bit adc and powerful dsp unit in the mlx90302 enables high accuracy and resolution of the thermometer. the calculated object and ambient temperatures are available in ram of mlx90302 with resolution of 0.0 2 ?c. they are accessible by 2 wire serial smbus compatible protocol (0.02c resolution) or via 10 - bit pwm (pulse width modulated) output of the device. the mlx 90616 is factory calibrated to allow operation in wide ambient temperature ranges from - 40 to 8 5 ?c . as a standard, the mlx9061 6 is supplied with a programmed object emissivity of 1. it can be easily changed by the customer for any ot her emissivity in the range 0.1 1.0 without the need for recalibration with a black body. the pwm can be easily custo mized for virtually any range desired by the customer by changing the content of 2 eeprom cells. this has no influence on the calibration of the device and temperature calculations in the device. only the pwm output is adjusted . it is a common issue wit h infrared thermometer guns that they are sensitive to ambient temperature variations. it has therefore often been required to let the thermometer stabilize for a long period (20 minutes) before achieving accurate measurements. the mlx90616esf - h ca incor porates a secondary thermopile sensor to sense thermal gradients in the package and in the optical assembly. the signal of this secondary sensor is used to compensate for the adverse effect these thermal gradients have on the measurement. in this way it is possible to make a thermometer gun which stabilizes very quickly (seconds) and gives accurate results in demanding environments.
mlx90616esf - hca infra red thermometer in to - 39 for high temperature thermometer guns 3901090616 page 3 of 36 data s heet rev 002 august 20, 2012 3 table of contents 1 functional diagram ................................ ................................ ................................ ................................ ................................ ................ 1 2 general description ................................ ................................ ................................ ................................ ................................ ............... 1 general description (continued) ................................ ................................ ................................ ................................ ................................ 2 3 table of contents ................................ ................................ ................................ ................................ ................................ .................. 3 4 glossary of terms ................................ ................................ ................................ ................................ ................................ ................. 4 5 maximum ratings ................................ ................................ ................................ ................................ ................................ ................... 4 6 pin definitions and descri ptions ................................ ................................ ................................ ................................ .............................. 5 7 electrical specifications ................................ ................................ ................................ ................................ ................................ ......... 6 8 detailed description ................................ ................................ ................................ ................................ ................................ ............... 8 8.1 block diagram ................................ ................................ ................................ ................................ ................................ ................ 8 8.2 signal processing principle ................................ ................................ ................................ ................................ ............................. 8 8.3 block description ................................ ................................ ................................ ................................ ................................ ............ 8 8.3.1 amplifier ................................ ................................ ................................ ................................ ................................ .................. 8 8.3.2 supply regulator and por ................................ ................................ ................................ ................................ ...................... 9 8.3.3 eeprom ................................ ................................ ................................ ................................ ................................ ................ 9 8.3.4 on - chip filtering and settling time: ................................ ................................ ................................ ................................ ......... 12 8.3.5 ram ................................ ................................ ................................ ................................ ................................ ...................... 13 8.4 smbus compatible 2 - wire protocol ................................ ................................ ................................ ................................ ............... 13 8.4.1 functional description ................................ ................................ ................................ ................................ ........................... 13 8.4.2 differences with the standard smbus specification (reference [1]) ................................ ................................ ........................ 14 8.4.3 detailed description ................................ ................................ ................................ ................................ ............................... 14 8.4.4 ac specification for smbus ................................ ................................ ................................ ................................ ................... 16 8.4.5 bit transfer ................................ ................................ ................................ ................................ ................................ ............ 17 8.4.6 commands ................................ ................................ ................................ ................................ ................................ ........... 17 8.4.7 sleep mode ................................ ................................ ................................ ................................ ................................ ........... 18 8.4.8 mlx90616 smbus specific remark s ................................ ................................ ................................ ................................ ...... 19 8.5 pwm ................................ ................................ ................................ ................................ ................................ ............................ 20 8.5.1 single pwm format ................................ ................................ ................................ ................................ ............................... 21 8.5.2 customizing the temperature range for pwm output ................................ ................................ ................................ ............. 22 8.6 switching between pwm and smbus communication ................................ ................................ ................................ .................. 23 8.6.1 pwm is enabled ................................ ................................ ................................ ................................ ................................ .... 23 8.6.2 request condition ................................ ................................ ................................ ................................ ................................ . 23 8.6.3 pwm is disabled ................................ ................................ ................................ ................................ ................................ ... 23 8.7 computation of ambient and object temperatures ................................ ................................ ................................ ......................... 24 8.7.1 ambient temperature ta ................................ ................................ ................................ ................................ ....................... 24 8.7.2 object temperature to ................................ ................................ ................................ ................................ .......................... 24 8.7.3 calculation flow ................................ ................................ ................................ ................................ ................................ ..... 24 8.8 thermal relay ................................ ................................ ................................ ................................ ................................ ............... 25 9 unique features ................................ ................................ ................................ ................................ ................................ .................. 26 10 performance graphs ................................ ................................ ................................ ................................ ................................ ......... 26 10.1 temperature accuracy of the mlx90616 ................................ ................................ ................................ ................................ .... 26 10.1.1 ambient temperature accuracy ................................ ................................ ................................ ................................ ............ 26 10.1.2 object temperature accuracy, using the internal temperature calculation algorithm ................................ ............................. 26 10.1.3 object temperatur e accuracy, with external calculation ................................ ................................ ................................ ....... 26 10.2 sensitivity ................................ ................................ ................................ ................................ ................................ ................... 26 10.3 noise ................................ ................................ ................................ ................................ ................................ .......................... 27 10.4 sensing element size ................................ ................................ ................................ ................................ ................................ . 27 10.5 field of view (fov) without external optics ................................ ................................ ................................ ................................ 27 10.6 spectral filter ................................ ................................ ................................ ................................ ................................ ............. 28 11 applications information ................................ ................................ ................................ ................................ ................................ ..... 29 11.1 use of the mlx90616 thermometer in smbus configuration ................................ ................................ ................................ ....... 29 11.2 use of multiple mlx90616s in smbus configuration ................................ ................................ ................................ ................... 29 11.3 pwm output operation ................................ ................................ ................................ ................................ ................................ 30 11.4 thermal alert / the rmostat ................................ ................................ ................................ ................................ ........................... 31 12 application comments ................................ ................................ ................................ ................................ ................................ ....... 31 13 standard information regarding manufacturability of melexis products with different sol dering processes ................................ .......... 33 14 esd precautions ................................ ................................ ................................ ................................ ................................ ............... 33 15 faq ................................ ................................ ................................ ................................ ................................ ................................ ... 33 16 package i nformation ................................ ................................ ................................ ................................ ................................ .......... 35 16.1 part marking ................................ ................................ ................................ ................................ ................................ ............... 35 17 references ................................ ................................ ................................ ................................ ................................ ........................ 36 18 disclaime r ................................ ................................ ................................ ................................ ................................ .......................... 36
mlx90616esf - hca infra red thermometer in to - 39 for high temperature thermometer guns 3901090616 page 4 of 36 data s heet rev 002 august 20, 2012 4 glossary of terms ptat proportional to absolute temperature sensor (package temperature) ptc positive temperature coefficient sensor (package temperature) por power o n reset hfo high frequency oscillator (rc type ) dsp digital signal processing fir finite impulse response. digital filter iir infinite impulse response. digital filter ir infra - red pwm pulse with modulation dc duty cycle (of the pwm) ; direct current (for settled conditions specifications) fov fi eld of v iew sda,scl serial data , serial clock C smbus compatible communication pins ta ambient temperature measured from the chip C ( the package temperature ) to object temperature , seen from ir sensor esd electro - static discharge emc electro - magneti c compatibility assp application specific standard product tbd to be defined note: sometimes the mlx9061 6 xxx is referred to as the module. 5 maximum ratings param e ter mlx 90616 supply voltage, v dd (over voltage) 5v supply voltage, v dd (operating) 3.6v reverse voltage 0. 4 v operating temperature range, t a - 40 + 8 5 ? c storage temperature range, t s - 40+1 2 5 ? c esd sensitivity (aec q100 002) 2kv dc sink current, sda / pwm pin 25 ma dc source current, sda / pwm pin 25 ma dc clamp current, sda / pw m pin 25 ma dc clamp current, scl pin 25 ma table 1 : absolute maximum ratings for mlx9061 6 exceeding the absolute maximum ratings may cause permanent damage. exposure to absolute - maximum - rated conditions for extended perio ds may affect device reliability.
mlx90616esf - hca infra red thermometer in to - 39 for high temperature thermometer guns 3901090616 page 5 of 36 data s heet rev 002 august 20, 2012 6 p in definitions and descriptions = figure 2 : pin description p in name function scl serial clock input for 2 wire communications protocol . sda / pwm digital input / output. in normal mode the measured object temperature is available at this pin pulse width modulated. in smbus compatible mode automatically configured as open drain nmos. vdd external supply voltage. vss ground. the metal can is also connected to thi s pin. table 2 : pin description mlx9061 6 with the scl and pwm / sda pins operated in 2 - wire interface mode, the input schmi t t trigger function is automatically enabled. 4 - vss 1 - scl 2 - sda/pwm 3 - vdd bottom view
mlx90616esf - hca infra red thermometer in to - 39 for high temperature thermometer guns 3901090616 page 6 of 36 data s heet rev 002 august 20, 2012 7 electrical specification s all parameters are preliminary for t a = 25 ?c, v dd =3v (unless otherwise specified) param e ter symbol test cond i tions min typ max units supplies external supply v dd 2. 6 3 3.6 v supply current i dd no load 1 2 ma supply current (programming) i ddpr no load, erase/write eeprom op erations 1.5 2 .5 ma sleep mode supply current isleep no load 1 2.5 5 ua sleep mode supply current isleep full temperature range 1 2.5 6 ua power on reset por level v por _up power - up (full temp range) 1. 4 1. 75 1.95 v por level v por _down power C down (fu ll temp range) 1 . 3 1. 7 1 . 9 v por hysteresis v por _hys f ull temp range 0 . 08 0.1 1 . 1 5 v v dd rise time (10% to 90% of specified s upply voltage) t por ensure por signal 20 m s output valid tvalid after por 0. 1 5 s pulse width modulation 1 pwm resolution p wmres data band 10 bit pwm output period pwm t,def factory default, internal oscillator factory calibrated 1 . 024 m s pwm period stability dpwm t internal oscillator factory calibrated, over the entire operation range and supply voltage - 4 +4 % output high level pwm hi i source = 2 ma v dd - 0.2 5 v output low level pwm lo i sink = 2 ma v ss +0.2 5 v output drive current idrive pwm vout,h = v dd - 0.8v 4. 5 ma output sink current isink pwm vout,l = 0.8v 1 1 ma continued next page .
mlx90616esf - hca infra red thermometer in to - 39 for high temperature thermometer guns 3901090616 page 7 of 36 data s heet rev 002 august 20, 2012 param e ter symbol test c ond i tions min typ max units smbus compatible 2 - wire interface 2 input high voltage v ih (ta,v) over temperature and supply vdd - 0.1 v input low voltage v il (ta,v) over temperature and supply 0.6 v output low voltage v ol sda pin in open drain mod e, over temperature and supply, isink = 2ma 0.25 v scl leakage i scl ,leak v scl =3v, ta=+85c 20 ua sda leakage i sda ,leak v sda =3v, ta=+85c 0.25 ua scl capacitance c scl 10 pf sda capacitance c sda 10 pf slave address sa factory default 5a he x wake up request t wake s da low 33 ms smbus request t req scl low 1. 44 ms timeout,low t imeout,l scl low 27 3 3 ms timeout, high t imeout,h scl high 45 5 5 us acknowledge setup time tsuac(md ) 8 - th scl falling edge, master 0.5 1.5 us acknowledge hol d time thdac(md ) 9 - th scl falling edge, master 1.5 2.5 us acknowledge setup time tsuac(sd) 8 - th scl falling edge, slave 2.5 us acknowledge hold time thdac(sd ) 9 - th scl falling edge, slave 1.5 us eeprom data retention ta = +85c 10 years erase/ write cycles ta = +25c 100,000 times erase/write cycles ta = +125c 10,000 times erase cell time terase 5 ms write cell time twrite 5 ms table 3 : elec t rical specificat i on mlx9061 6 bxx notes: all the communication and refresh rate timings are given for the nominal calibrated hfo frequency and will vary with this frequencys variations. 1. all pwm timing specifications are given for single pwm output. with large capacitive load s, a lower pwm frequency is recommended. th ermal relay output (when configured) has the pwm dc specification and can be programmed as push - pull, or nmos open drain. pwm is free - running; power - up factory default is smbus . 2. for smbus compatible interface on 12v application refer to application inf ormation section. smbus compatible interface is described in details in the smbus detailed description section. the m aximum number of mlx9061 6 xxx devices on one bus is 127, higher pull - up currents are recommended for higher number of devices, faster bus da ta transfer rates, and increased reactive loading of the bus. the mlx9061 6 is always a slave device on the bus. the mlx9061 6 can work in both low - power and high - power smbus communication. all voltage s are referred to the vss (ground) unless otherwise noted .
mlx90616esf - hca infra red thermometer in to - 39 for high temperature thermometer guns 3901090616 page 8 of 36 data s heet rev 002 august 20, 2012 8 detai led d escription 8.1 block diagram figure 3 : block diagram 8.2 signal processing principle the operation of the m lx 90 61 6 is controlled by an internal state machine, which controls the measurements and c alculations of the object and ambient temperatures and does the post - processing of the temperatures to output them through the pwm output or the smbus compatible interface . the output of the ir sensor s is amplified by a low noise low offset chopper amplif ier with programmable gain, con verted by a sigma delta modulator to a single bit stream and fed to a powerful dsp for further processing. the signal is treated by programmable (by means of eeprom conten t ) fir and iir low pass filters for further reduction of the bandwidth of the input signal to achieve the desired noise performance and refresh rate. the output of the iir filter is the measurement result and is available in the internal ram. 3 different cells are available: one for the on - board temperature s ensor (on chip ptat or ptc) and 2 for the ir sensors. based on results of the above measurements , the correspon ding ambient temperature ta and object temperature to are calculated. both calculated temperatures have a resolution of 0.0 2 ?c . the data for ta and to can be read in two ways: reading ram cell s dedicated for this purpose via the 2 - wire interface (0.02c resolution , fixed ranges ) , or t h rough the pwm digital output (10 bit resolution, configurable range) . in the last step of the measurement cycle , the measured ta and to are rescaled to the desired output resolution of the pwm) and the recalculated d at a is loaded in the registers of the pwm state machine, which creates a constant frequency with a duty cycle representing the measur ed data. 8.3 b lock description 8.3.1 amplifier a low noise , low offset amplifier with programmable gain is used for amplif ying the ir sensor voltage . by carefully design ing the input modulator and balanced input impedance , an offset below 0.5 v is achieved. 81101 opa adc dsp pwm state machine t voltage regulator 90302
mlx90616esf - hca infra red thermometer in to - 39 for high temperature thermometer guns 3901090616 page 9 of 36 data s heet rev 002 august 20, 2012 8.3.2 supply regulator and por the power on reset (por) is connected to vdd supply. the on - chip por circuit provides an active (high) level of the por signal when the vdd voltage rises above approximately 0.5v and holds the entire mlx9061 6 in reset until the vdd is hig her than the specified por threshold v por . during the time por is active, the por signal is available as an open drain at the pwm/sda pin. after the mlx9061 6 exits the por condition, the function programmed in eeprom takes precedence for that pin. 8.3.3 eeprom a limited number of addresses in the eeprom memory can be changed by the customer . the whole eeprom can be read through the smbus interface . eeprom (32x16) n ame a ddress write access to max 0x000 yes to min 0x001 yes pwmctrl 0x 002 yes ta range 0x003 yes emissivity correction coefficient 0x004 yes con fig register1 0x005 yes calibration coefficients 0x006 calibration mode calibration coefficients 0x 00 d calibration mode smbus address 0x 00 e yes calibration coefficients 0x 0 0f yes calibration coefficients 0x010 calibration mode calibration coefficients 0x 018 calibration mode config register2 0x019 yes melexis reserved 0x01a no melexis reserved 0x01b no id number 0x01c no id number 0x01d no id number 0x01e no id numb er 0x01f no table 4 : eeprom table the addresses to max , to min and ta range are for customer dependent object and ambient temperature ranges. for details see section 8.5.2 below in this document the ad dress emissivity contains the object emissivity (factory default 1.0 = 0xffff), 16 bit. emissivity = dec2hex[ round( 65535 x ) ] where dec2hex[ round( x ) ] represents decimal to hexadecimal conversion with round - off to nearest value (not truncation). in this case the physical emissivity values are = 0.11.0. erase (write 0) must take place before write of desired data is made.
mlx90616esf - hca infra red thermometer in to - 39 for high temperature thermometer guns 3901090616 page 10 of 36 data s heet rev 002 august 20, 2012 pwm period configuration: the p eriod in extended pwm mode is twice the period in single pwm mode. in single pwm mode period is t = 1.024*p [ms], where p is the number, written in bits 15 9 pwmctrl. maximum period is then 131.072 ms for single and 262.144 ms for extended. these values are typical and depend on the on - chip rc oscillator absolute value. the duty cycle must be cal culated instead of working only with the high time only in order to avoid errors from the period absolute value deviations. the address pwmctrl consist s o f control bits for configuring the pwm /sda pin as shown in table 5 : 15 14 1 3 12 11 10 9 8 7 6 5 4 3 2 1 0 pwm control bit meaning 0 - pwm extended mode 1 - pwm single mode 0 - pwm mode disabled (en_pwm) 1 - pwm mode enabled (en_pwm ) 0 - sda pin configured as open drain (ppodb) 1 - sda pin configured as push - pull (ppodb) 0 - pwm mode selected (trpwmb) 1 - thermal relay mode selected (trpwmb) - pwm repetition number 062 step 2 - pwm period 1.024*ms (single pwm mode) or 2.048*ms (extendet pwm mode) multiplied by the number written in this place (128 in case the number is 0) * values are valid for nominal hf o frequency table 5 : pwm control bits
mlx90616esf - hca infra red thermometer in to - 39 for high temperature thermometer guns 3901090616 page 11 of 36 data s heet rev 002 august 20, 2012 the address configregister1 consist s of control bits for configuring the analog and digital parts: 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 config register bit meaning 1 0 0 - iir (100%) a1=1, b1=0 1 0 1 - iir (80%) a1=0.8, b1=0.2 1 1 0 - iir (67%) a1=0.666, b1=0.333 1 1 1 - iir (57%) a1=0.571, b1=0.428 0 0 0 - iir (50%) a1=0.5, b1=0.5 0 0 1 - iir (25%) a1=0.25, b1=0.75 0 1 0 - iir (17%) a1=0.166(6), b1=0.83(3) 1 1 1 - iir (13%) a1=0.125, b1=0.875 0 - re peat sensor test "off" 1 - repeat sensor test "on" 0 0 - ta on pwm channel 1, tobj1 on pwm channel 2 0 1 not valid 1 0 not valid 1 1 - tobj 1 on pwm channel 1 1 - this bit should always be set to '1' m - melexis reserved - do not change 0 0 0 - fir = 8 not recommended 0 0 1 - fir = 16 not recommended 0 1 0 - fir = 32 not recommended 0 1 1 - fir = 64 not recommended 1 0 0 - fir = 128 1 0 1 - fir = 256 1 1 0 - fir = 512 1 1 1 - fir = 1024 0 0 0 - gain = 1 - amplifier is bypassed 0 0 1 - gain = 3 0 1 0 - gain = 6 0 1 1 - gain = 12,5 1 0 0 - gain = 25 1 0 1 - gain = 50 1 1 0 - gain = 100 1 1 1 - gain = 100 m - melexis reserved - do not change 0 - enable sensor test 1 - disable sensor test note: the following bits/registers should not be altered (except with special tools C contact melexis for tools availability) in order to keep the factory calibration relevant: ke [15..0] ; config regist er1 [13..11; 7;3] ; addresses 0x 00f and 0x 019. table 6 : configuration register 1
mlx90616esf - hca infra red thermometer in to - 39 for high temperature thermometer guns 3901090616 page 12 of 36 data s heet rev 002 august 20, 2012 8.3.4 on - chip filtering and set tling time: the mlx9061 6 features configurable on - chip digital filters. they allow customization for speed or noise. details on the filters are given in the application note understanding mlx 90616 on - chip digital signal filters available from www.melexis.com . the a vailable filter settings and the settling times they give are listed below. settling time depends on two configurations : iir filter settings and fir filter settings. the fir filter has a straightforward e ffect on noise ( a 4 times decrease of settling time increases the noise 2 times and vice versa). the iir filter provides an additional , spike limiting , feature . spike limit is also listed and defines to what level the magnitude of a spike would be limited C for example, 25% denotes that if a 20c temperature delta spike is measured the temperature read ing by the mlx 90616 will spike only 5c. more details are available in the application notes from www.melexis.com . i ir setting fir setting settling time (s) spike limit xxx 000011 100 100 0.06 100.0% 100 101 0.07 100.0% 100 110 0.10 100.0% 100 111 0.14 100.0% 101 100 0.20 80.0% 101 101 0.24 80.0% 101 110 0.34 80.0% 101 111 0.54 80.0% 110 100 0.38 66.7% 110 1 01 0.48 66.7% 110 110 0.67 66.7% 110 111 1.10 66.7% 111 100 0.42 57.0% 111 101 0.53 57.0% 111 110 0.75 57.0% 111 111 1.20 57.0% 000 100 0.47 50.0% 000 101 0.60 50.0% 000 110 0.84 50.0% 000 111 1.33 50.0% 001 100 1.10 25.0% 001 101 1.40 25.0% 0 01 110 2.00 25.0% 001 111 3.20 25.0% 010 100 1.80 16.7% 010 101 2.20 16.7% 010 110 3.20 16.7% 010 111 5.00 16.7% 011 100 2.40 12.5% 011 101 3.00 12.5% 011 110 4.30 12.5% 011 111 7.00 12.5% table 7 : possible iir and fir set tings note: settling time is in seconds and depends on internal oscillator absolute value. 100% spike limit appears with the iir filter bypassed, and there is no spike limitation.
mlx90616esf - hca infra red thermometer in to - 39 for high temperature thermometer guns 3901090616 page 13 of 36 data s heet rev 002 august 20, 2012 8.3.5 ram it is not possible to write into the ram memory. i t can only be read a nd only a limited number of ram registers are of interest to the customer. ram (32x17) n ame a ddress read acces s melexis reserved 0x 000 yes melexis reserved 0x 00 3 yes raw data ir main channel 0x 004 raw data ir compensation 0x005 t a 0x006 yes t obj 0x007 yes melexis reserved 0x008 yes melexis reserved 0x01f yes table 8 : ram addresses 8.4 smbus compatible 2 - wire protocol the chip support s a 2 wire serial protocol, buil t with pins pwm/sda and scl. ? scl C digital in put, used as the clock for smbus compatible communication. this p in has the auxiliary function for building an external voltage regulator. when the external voltage regulator is used, the 2 - wire protocol is available only if the power supply regulator is o verdriven. ? pwm/sda C digital input/output, used for both the pwm output of the measured object temperature(s) or the digital input/output for the smbus. the p in can be programmed in eeprom to operate as push/pull or open drain nmos (open drain nmos is fac tory default) . in smbus mode sda is forced to open drain nmos i/o, push - pull selection bit defines pwm/thermal relay operation. 8.4.1 functional description the smbus interface is a 2 - wire protocol, allowing communication between the master device ( md ) and one o r more slave devices ( sd ) . in the system only one master can be presented at a ny given time [1]. the mlx 90616 can only be used as a slave device . generally, the md initiates the start of data transfer by selecting a sd through the slave address ( sa ) . t h e md has read access to the ram and eeprom and write access to 9 eeprom cells (at addresses 0x20h, 0x21h, 0x22h, 0x23h, 0x24h, 0x25h*, 0x2eh, 0x2fh, 0x39h). if the access to the mlx 90616 is a read operation it will respond with 16 data bits and 8 bit pec o nly if its own slave address, programmed in internal eeprom, is equal to the sa, sent by the master. the sa feature allows connecting up to 127 devices with only 2 wires, unless the system has some of the specific features described in paragraph 5.2 of ref erence [ 1]. in order to provide access to any device or to assign an address to a sd before it is connected to the bus system, the communication must start with zero sa followed by low rwb bit. when this command is sent from the md, the mlx9061 6 will alway s respond and will ignore the internal chip code information. special care must be taken not to put two mlx90 61 6 devi c es with the same sd addresses on the same bus as mlx90 61 6 does not support arp [ 1]. t he md can f orce the mlx 90616 into low consumption m ode sleep mode (3v version only). read flags like eebusy (1 C eeprom is busy with executing the previous write/erase), ee_dead (1 C there is fatal eeprom error and this chip is not functional**). note*: this address is readable and writable. bit 3 sh ould not be altered as this will cancel the factory calibration. note**: eeprom error signaling is implemented in automotive grade parts only.
mlx90616esf - hca infra red thermometer in to - 39 for high temperature thermometer guns 3901090616 page 14 of 36 data s heet rev 002 august 20, 2012 8.4.2 difference s with the standar d smbus specification (reference [1] ) there are eleven command protocols for standard smbus interface. the mlx 90616 supports only two of them. not supported commands are: ? quick command ? byte commands - sent byte, receive byte, write byte and read byte ? process call ? block commands C block write and write - block read process call supported comm ands ar e : ? read word ? write word 8.4.3 detailed description the pwm/sda pin of mlx 90 61 6 can operate also as pwm output, depending on the eeprom settings. if pwm is enabled , after por the pwm/sda pin is directly configured as pwm output. the pwm mode can be avoided and the pin can be restore d to its data function by a special command. that is why hereafter both modes are treated separately. 8.4.3.1 bus protocol figure 4 : smbus packet element key after every 8 bits receiv ed by the sd an ack/nack takes place. when a md initiates communication , it first sends the address of the slave and only the sd which recognizes the address will ack , the rest will remain silent. in case the sd nacks one of the bytes , the md should stop t he communication and repeat the message. a nack could be received after the pec. this means that there is an error in the received message and the md should try sending the message again. the pec calculation includes all bits except the start, repeated sta rt, stop, ack, and nack bits. the pec is a crc - 8 with polynomial x8+x2+x1+1. the most significant bit of every byte is transferred first. s wr slave address a data byte a p s start condition sr repeated start condition rd read (bit value of 1) wr write (bit value of 0) a acknowledge (this bit can be 0 for ack and 1 for nack) s stop condition pec packet error code master - to - slave slave - to - master 1 1 7 1 8 1 1
mlx90616esf - hca infra red thermometer in to - 39 for high temperature thermometer guns 3901090616 page 15 of 36 data s heet rev 002 august 20, 2012 8.4.3.1.1 read word (depending on the command C ram or eeprom) figure 5 : s mbus read word format 8.4.3.1.2 write word (eeprom) figure 6 smbus write word format figure 7 : smbus communication examples (read ram and write eeprom) s wr slave address a data byte low a p command a sr slave address rd 1 7 1 1 8 1 1 7 1 8 1 1 .. .. a 1 data byte high a 8 1 pec a 8 1 s wr slave address a data byte low a p command a 1 7 1 1 8 1 8 1 1 .. .. data byte high a 8 1 pec a 8 1
mlx90616esf - hca infra red thermometer in to - 39 for high temperature thermometer guns 3901090616 page 16 of 36 data s heet rev 002 august 20, 2012 8.4.4 ac specification for smbus 8.4.4.1 timing the m lx 9061 6 meets all the timing specifications of the smbus [1]. the maximum frequency of the mlx 90616 smbus is 100 khz and the minimum is 10 khz . the specific timings in mlx 90616 s smbus are: smbus request ( t req ) is the time that the scl should be for ced low in order to switch mlx 90616 from pwm mode to smbus mode C at least 1.44ms ; timeout l is the maximum allowed time for scl to be low. after this time the mlx 90616 will reset its communication block and will be ready for new communication C not more than 45us ; timeout h is t he maximum time for which it is allowed for scl to be high during communication . after this time mlx 90616 will reset its communication block assuming that the bus is idle ( according to the smbus specification ) C not more than 27ms . tsuac(sd) is the time after the eighth falling edge of scl that mlx 90616 will force pwm/sda low to acknowledge the last received byte C not more than 2 . 5 s . thdac(sd) is the time after the ninth falling edge of scl that mlx 90616 will release the pwm/s da (so the md can continue with the communication) C not more than 1 . 5 s . tsuac(md) is the time after the eighth falling edge of scl that mlx 90616 will release pwm/sda ( so that the md can acknowledge the last received byte ) C not more than 0 . 5 s . thdac(m d) is the time after the ninth falling edge of scl that mlx 90616 will take control of the pwm/sda ( so it can continue with the next byte to transmit ) C not more than 1 . 5 s . the indexes md and sd for the latest timings are used C md when the master device i s making acknowledge; sd when the sla ve device is making acknowledge . for other timings see [1]. figure 8 : smbus timing pwm/sda scl t suac t hdac t imeout ,l t imeout ,h > 27ms > 47us sd<2.5us md<0.5us sd<1.5us md<1.5us
mlx90616esf - hca infra red thermometer in to - 39 for high temperature thermometer guns 3901090616 page 17 of 36 data s heet rev 002 august 20, 2012 8.4.5 bit transfer figure 9 : bit transfer on smbus the d ata on pwm/sda must be changed when scl is low (min 300ns a fter the falling edge of scl ). the data is fetched by both md and sds on the rising edge of the scl. the recommended timing for changing data is in the middle of the period when the scl is low. 8.4.6 com mands ram and eeprom can be read both with 32x16 sizes. if the ram is read, the data are divided by two, due to a sign bit in ram (for example, t obj - ram address 0x07h will sweep between 0x27adh to 0x f fff as the object temperature rises from - 70.01c to + 1037 . 55 c). the msb for the raw data (e.g. ir sensor1 data) is a sign bit (sign and magnitude format). a write of 0x0000 must be done prior to writing in eeprom in order to erase the eeprom cell content. refer to eeprom detailed description for factory ca libra tion eeprom locations that need to be kept unaltered. opcode command 000x xxxx* ram access 001x xxxx* eeprom access 1111_0000** read flags 1111_1111 enter sleep mode table 9 : smbus commands note*: the xxxxx represent the 5 lsbits of the memory map address to be read/written. note**: behaves like read command. the mlx 90616 returns pec after 16 bits data of which only 4 are meaningful and if the md wants it, it can stop the communication after the first byte. the difference between read and read flags is that the latter does not have a repeated start bit. flags read are: data[7] - eebusy - the previous write/erase eeprom access is still in progress. high active. data[6] - unused data[5] - ee_dead - eeprom double error has o ccurred. high active. data[4] - init - por initialization routine is still ongoing. low active. data[3] - not implemented. data[2..0] and data[8..15] - all zeros. flags read is a diagnostic feature. the mlx 90616 can be used regardless of these flags. for details and examples for smbus communication with the mlx9061 6 check the www.melexis.com pwm/sda scl sampling data changing data
mlx90616esf - hca infra red thermometer in to - 39 for high temperature thermometer guns 3901090616 page 18 of 36 data s heet rev 002 august 20, 2012 8.4.7 sleep mode the mlx9061 6 can enter in sleep mode via the command enter sleep mode sent via the smbus interface. this mode is not available for the 5v supply version . to limit the current consumption to 2. 5ua (typ ical ), the scl pin should be kept low during sleep. mlx9061 6 goes back in to power - up default mode (via por reset) by setting scl p in high and then pwm/sda p in low for at least t ddq = 80 ms. if eeprom is configured for pwm (en_pwm is high), the pwm interface will be selected after awakening and if pwm control [2], ppodb is 1 the mlx 90616 will output a pwm pulse train with push - pull output. 8.4.7.1 enter sleep mode figure 10 : enter sleep 8.4.7.2 exit from sleep mode figure 11 : exit sleep mode sleep command stop condition stop sleep scl pwm/sda sleep awake scl pwm/sda twake > 33ms
mlx90616esf - hca infra red thermometer in to - 39 for high temperature thermometer guns 3901090616 page 19 of 36 data s heet rev 002 august 20, 2012 first data is available 0.2 5 seconds (typ . ) after exit from sleep is done. on - chip iir filter is skipped for the very first measurement. all measure ments afterwards pass the embedded digital filtering as configured in eeprom. details on embedded filtering are available in application note understanding mlx 90616 on - chip digital signal filters , available from www .melexis.com scl line is kept low in order to reduce current leakage t h rough the pin (artificial zener diode is connected to that pin). 8.4.8 mlx9061 6 smbus specific remarks continuous smbus readings can introduce an error. as the scl line inside to39 packag e is passing relatively close to the sensor input and error signal is induced to the sensor output. the manifestation of the problem is wrong temperature readings. this is especially valid for narrow fov devices. possible solution is to keep sda and scl li ne qui et for period longer than refresh rate and settling time defined by internal settings of mlx9061 6 prior to reading the temperature or switch to pwm signal and completely disconnect from sda and scl line.
mlx90616esf - hca infra red thermometer in to - 39 for high temperature thermometer guns 3901090616 page 20 of 36 data s heet rev 002 august 20, 2012 8.5 pwm the mlx9061 6 can be read via pwm or smbu s compatible interface. selection of pwm output is done in eeprom configuration (factory default is smbus ). pwm output has two programmable formats, single and dual data transmission, providing single wire reading of two temperatures (dual zone object or o bject and ambient). the pwm period is derived from the on - chip oscillator and is programmable. config register[5:4] pwm1 data pwm2 data tmin,1 tmax,1 tmin,2 tmax,2 00 ta t obj ta range ,l ta range ,h to min to max 01 undefined undefined n.a. n.a. n.a. n.a. 11 undefined undefined n.a. n.a. n.a. n.a. 11 t obj1 t obj2 to min to max to min to max table 10 : pmw configuration table note: serial data functions (2 - wire / pwm) are multiplexed with a thermal relay function (described in the thermal relay section). * not recommended for extended pwm format operation figure 12 : pwm timing single (above) and extended pwm (below) pwm type t1 t2 t3 t4 t5 t6 t7 t8 single 1/8 C high 4/8 - var 2/8 1/8 C low na na na na extended - s 1 1/16 - high 4/16 - var 2/16 1/16 - low 1/16 - low 4/16 C low 2/16 - low 1/16 - low extended - s2 1/16 - high 4/16 - high 2/16 - high 1/16 - high 1/16 - high 4/16 - var 2/16 1/16 - low table 11 : pmw timing t1 t2 t3 t4 f e valid data band error band start stop 0 t 5 8 t 1 8 t 13 16 t 7 8 t t1 t2 t3 t4 f e sensor 1 error band start stop 0 t 1 16 t t 5 16 t 7 16 t 8 16 valid data band t5 t6 sensor 1 t7 f e error band sensor 2 sensor 2 valid data band t8 t 9 16 t 13 16 t 15 16
mlx90616esf - hca infra red thermometer in to - 39 for high temperature thermometer guns 3901090616 page 21 of 36 data s heet rev 002 august 20, 2012 8.5.1 single pwm format in single pwm output mode only the settings for pwm1 data are used. the t emperature reading can be calculated from the signal timing as: where tmin and tmax are the co r responding rescale coefficients in eeprom for the selected tempera ture output (ta, object temperature range is valid for tobj as specified in the pre vious table) and t is the pwm period. tout is t obj or t a according to config register [5:4] settings. the different time intervals t 1 t 4 ha ve the following meaning : t 1 : start buffer. during this time the signal is always high. t 1 = 0.125*t (t is the pwm period, refer to fig. 1 3 ) . t 2 : valid data output band, 0 1/2t. pwm output data resolution is 10 bit. t 3 : error band C information for fatal error in eeprom (double error detec ted, not correctable). t 3 = 0.25 * t. therefore a pwm pulse train with a duty cycle of 0.875 will indicate a fatal error in eeprom (for single pwm format) . fe mean s fatal error. example: figure 13 : pwm example single mode to _ min = 0c => to min [eeprom] = 100 * (to min + 273.15) = 0x 6ab3 to _ max = +50c => to max [eeprom] = 100 * (to max + 273.15) = 0x7e3b captured pwm period is t = 1004 s captured high duration is t = 392 s calculated duty cycle is: or the temperature is calculated as follows: ? ? min o min o max o out t t t t t t _ _ _ 2 2 ? ? ? ? ? ? ? ? ? 3904 . 0 1004 392 ? ? ? t t d % 04 . 39 ? ? ? ? c t o ? ? ? ? ? ? ? 54 . 26 50 * 2554 . 0 * 2 0 0 50 * 125 . 0 3904 . 0 * 2
mlx90616esf - hca infra red thermometer in to - 39 for high temperature thermometer guns 3901090616 page 22 of 36 data s heet rev 002 august 20, 2012 8.5.2 customizing the temperature range for pwm output the calculated ambient and object temperatures are stored in ram with a resolution of 0.0 2 c (16 bit). the pwm operates with a 10 - bit word so the transmitted temperature is rescaled in order to fit in the desired range . for this goal 2 cells in the eeprom are foreseen t o store the desired range for to (to min and to max ) and one for ta (ta range : the 8msb are foreseen for ta max and the 8lsb for ta min ). thus the output range for to can be programmed with an accuracy of 0.0 2 c, while the corresponding ta range can be program med with an accuracy of 0.64 c. the object data for pwm is rescaled according to the following equation: the t ram is the linearized tobj, 16 - bit ( 0x 0000 0x ffff, 0x 0000 for - 273.15c and 0x ffff for + 1037.55 c) and the result is a 1 0 - bit word, in which 0x 000h corresponds to t o min [c] , 0x 3ffh corresponds to t o max [c] and 1lsb corresponds to [c] lsb lsb the ambient data for pwm is rescaled according to the following equation: the result is a 10 - bit word, where 000h corresponds to - 38.2 c (lowest ta that can be read via pwm) , 3ffh corresponds to 125 c (highest ta that can be read via pwm) and 1lsb corresponds to [c] lsb lsb 1023 , eeprom eeprom eeprom obj min max obj pwm obj pwm min ram pwm t t k k t t t ? ? ? ? 1023 min max to to ? 50 ? ? min min t t eeporm 50 ? ? max max t t eeporm 1023 , eeprom eeprom ambient eeprom ambient min max ambient pwm pwm min ram pwm t t k k t t t ? ? ? ? 1023 min max t t ? ? ? ? ? 64 100 2 . 38 ? ? ? ? min min t t eeporm ? ? ? ? 64 100 2 . 38 ? ? ? ? max max t t eeporm
mlx90616esf - hca infra red thermometer in to - 39 for high temperature thermometer guns 3901090616 page 23 of 36 data s heet rev 002 august 20, 2012 8.6 switching between pwm and smbus communication 8.6.1 pwm is enabled the diagram below illustrates the way of switching to smbus if pwm is enabled ( factory programmed por default for mlx 90616 is smbus, pwm dis ab led ). note that the scl pin needs to be kept high in order to use pwm. figure 14 : switching from pwm mode to smbus 8.6.2 request condition figure 15 : request (switch to smbus) condition if pwm is enabled, the mlx 90616 s smbus request condition is needed to disable pwm and reconfigure pwm/sda pin before starting smbus communication. once pwm is disable d , it can only be enabled by switching the supply off C on or exit from sleep mode. the mlx 90616 s smbus req uest condition requires forcing low the scl pin for period longer than the request time (t req ) >1,44ms . the sda line value is ignored in this case. 8.6.3 pwm is disabled if pwm is disabled by means of eeprom the pwm/sda pin is directly used for the smbus purpose s after por. request condition should not be sent in this case . scl pwm/sda start stop t req pwm mode smbus mode >1.44ms scl smbus request t req >1,44ms
mlx90616esf - hca infra red thermometer in to - 39 for high temperature thermometer guns 3901090616 page 24 of 36 data s heet rev 002 august 20, 2012 8.7 computation of ambient and object temperatures the ir sensor consists of serial connected thermo - couples with cold junctions placed at thick chip substrate and hot junctions, placed over thin membrane. the ir radiation absorb ed from the membrane heats (or cool s ) it. the thermopile output signal is : , where to is the object temperature absolute (kelvin) temperature, ta is the sensor die absolute (kelvin) temperature, an d a is the overall sensitivity. an on board temperature sensor is needed to measure the chip temperature. after measurement of the output of both sensors , the corresponding ambient and object temperatures can be calculated. these calculations are done by t he internal dsp, which produces digital outputs, linearly proportional to measured temperatures. 8.7.1 a mbient temperature ta the sensor die temperature is measured with a ptc or a ptat element. all the sensors conditioning and data processing is handled on - chip and the linearized sensor die temperature ta is made available in memory. the resolution of the calculated temperature is 0.0 2 ?c . the sensor is factory calibrated for the full automotive range ( - 40 + 125 ?c ). in ram cell 006h, 2de4 h corresponds to - 38.2 ?c (linearization output lower limit) and 4 dc 4h (1 9908 d) corresponds to 125 ?c . the conversions from ram conten t to real ta is ea sy using the following relation : , or 0.02 k / lsb. 8.7.2 o bject temperature to the result has a resolution of 0.0 2 ?c and is available in ram. t o is derived from ram as : , or 0.02 k / lsb. example: 1. 0x 0000 => - 273 . 15 ? c ( - min possible value returned by mlx 90616 2. 0x 0001 => - 273.13 ? c 3. 0x 0002 => - 273 . 11 ? c and so on 4. 0x 3af7 => 28 . 75 ? c 5. 0x 7fff => 382 . 19 ? c - max possible value returned by mlx 90616 6. 0xffff => 1037.55 - max possible value returned by mlx 90616 the result is calculated by using the following expressions: 1. convert it to decimal value i.e 0x 3af7 = 15095d 2. divide by 50 (or multiply by 0 . 02) i.e. 15 095/50 =301 . 9k (result is in kelvin) 3. convert k - > ? c i.e. 301 . 9 - 273 . 15=28 . 75 ? c 8.7.3 calculation flow the measurement, calculation and lineari z ation are held by core, which executes a program form rom. after por the chip is initialized with calibration data from eeprom. measurements, compensation and lineari z ation routines run in a closed loop afterw ards. ? ? ? ? 4 4 . , ta to a to ta v ir ? ? 02 . 0 ] [ ? ? ? tareg k ta 02 . 0 ] [ ? ? ? toreg k to
mlx90616esf - hca infra red thermometer in to - 39 for high temperature thermometer guns 3901090616 page 25 of 36 data s heet rev 002 august 20, 2012 8.8 thermal relay the mlx 90616 can be configured to behave as a thermo relay with programmable threshold and hysteresis on the pwm/sda pin. t he input for the comparator unit of the relay is the object temperature from sensor 1 the output of the mlx9061 6 is not a relay driver but a logical output which should be connected to a relay driver if necessary. the output driver is one and the same for pwm and thermal relay. in order to configure the mlx 90616 to work as thermal relay two conditions must be met: o s et bit trpwmb high at address 002 h in eeprom o enable pwm output i.e. en_pwm is set high the pwm/sda p in can be programmed as a push - pull or open drain nmos ( via bit ppodb in eeprom pwmctrl ), which can trigger an external device. the temperature threshold data is determi ned by eepro m at address 021 h (tomin) and the hysteresis at address 020 h (to max ). the logical state of the pwm/sda p in is as follow s : pwm/sda p in is high if pwm/sda p in is low if figure 16 : thermal relay : pwm pin versus tobj the mlx90 61 6 preserves its normal operation when configured as a thermal relay (pwm configuration and specification applies as a general rule also for the thermal relay) and therefore it can b e read using the smbus (entering the smbus mode from both pwm and thermal relay configuration is the same ). for example, the mlx90 61 6 can generate a wake - up alert for a system upon reaching a certain temperature and then be read as a thermometer. a r eset condition (enter and exit sleep, for example) will be needed in order to return to the thermal relay configuration. example : threshold = 5 c ? (5 + 273.15 )* 5 0 = 13908 ? eeprom 0x0001= 0x3654 hysteresis = 1c ? 1* 50 = 50 ? eeprom 0x0000= 0x0032 (smallest poss ible hysteresis is 0, 02 c or 0x000 1) pwm/sda p in will be low at object temperature below 4 c pwm/sda p in will be high at object temperature higher that 6 c hysteresis threshold t obj ? ? 1 hysteresis threshold t obj ? ? 1 threshold hysteresis hysteresis t 0 1
mlx90616esf - hca infra red thermometer in to - 39 for high temperature thermometer guns 3901090616 page 26 of 36 data s heet rev 002 august 20, 2012 9 unique features ? the mlx9061 6 is a non contact thermometer which can be calibrated by the user for an output linearly dependent on the object temperature with high accuracy and high resolution . ? the high thermal stability of the mlx9061 6 - hca make s this part highly suited in applications where secondary heat sources can heat up the sensor. these se nsors also have a very short stabilization time compared to other types of thermopile sensors, which is of importance if one needs an accurate measurement in conditions where the ambient temperature can change quickly. ? the mlx9061 6 supports v ersatile cus tomization to a v ery wide range of temperatures and refresh rates . ? the user can program the internal object emissivity correction for objects with a low emissivity. an embedded error checking and correction mechanism provides high memory reliability. ? the sensors are housed in an i ndustr y standard to39. ? the low power consumption during operation and the low current draw during sleep mode make the thermometer ideally suited for handheld mobile applications. ? the digital sensor interface can be either a pow er - up - and - measure pwm or an enhanced access smbus compatible protocol . systems with more than 100 devices can be built with only two signal lines. ? a buil d - in t hermal relay function further extends the easy implementation of wide variety of freezing/boilin g prevention and alert systems, as well as thermostats (no mcu is needed). 10 performance graphs 10.1 temperature a ccuracy of the mlx906 1 6 all accuracy specifications apply under settled isothermal conditions only. 10.1.1 ambient temperature accuracy the factory calib rated tambient accuracy is +/ - 0.5 o c, 0 to 50 o c. it is +/ - 1 o c outside that range. 10.1.2 object temperature accuracy, using the internal temperature calculation algorithm the tobject linearization calculation error is less than +/ - 0.2 o c or 0.2% of the measurem ent value, whichever is bigger. the tobject accuracy after calibration by the customer can be better than +/ - 0.5 o c or 1.5% of measured value, whichever is bigger. this depends on the calibration scheme and care taken during the calibration by the custom er. to achieve this result, melexis recommends the use of specific object temperature calibration points. other reference temperatures can be used, but the accuracy has to be evaluated in that case. please consult melexis for more information on the c alibration procedure of the mlx90616. 10.1.3 object temperature accuracy, with external calculation the user has the option to use custom linearization algorithms using the raw irdata information in the ram memory. 10.2 s ensitivity the sensitivity of the mlx90616 is 100 ls bits, tobject = 80 o c, tambient = 25 o c.
mlx90616esf - hca infra red thermometer in to - 39 for high temperature thermometer guns 3901090616 page 27 of 36 data s heet rev 002 august 20, 2012 10.3 noise the noise of the mlx90616 is 15 bits/ hz peak to peak , tambient = 25 o c. param e ter test cond i tions min typ max units ambient temperature accuracy 0 to 50 o c - 0.5 o c + 0.5 o c - 40 o c mlx90616esf - hca infra red thermometer in to - 39 for high temperature thermometer guns 3901090616 page 28 of 36 data s heet rev 002 august 20, 2012 parameter mlx90616xxa peak zone 1 0 width zone 1 90 tabl e 12 : fov summary table figure 18 : typical fov of mlx9061 6 10.6 spectral filter the mlx90616 uses a filter with a transmission region between 8 and 14um . figure 19 : transmission s pectrum of the filter integrated in the mlx90616 0.00 0.25 0.50 0.75 1.00 -80 -60 -40 -20 0 20 40 60 80 angle, deg 0 20 40 60 80 100 0 2 4 6 8 10 12 14 16 wavelength (um) transmittance (% )
mlx90616esf - hca infra red thermometer in to - 39 for high temperature thermometer guns 3901090616 page 29 of 36 data s heet rev 002 august 20, 2012 11 applications information 11.1 use of the mlx9061 6 thermometer in smbus configuration figure 20 : mlx9061 6 smbus connection figure 20 shows the c onnection of a ml x9061 6 to a smbus with 3.3v power supply. the mlx9061 6 has diode clamps sda/scl to vdd so it is necessary to provide mlx 90616 with power in order not to load the smbus lines. 11.2 use of multiple mlx9061 6 s in smbus configuration figure 21 : use of multiple mlx9061 6 devices in smbus network the mlx9061 6 supports a 7 - bit slave address in eeprom , thus allowing up to 127 devices to be read via two common wires. current source pull - ups may be preferred with higher capacitive loading on the bus (c3 and c4 represent the lines parasitics) , while simple resistive pull - ups provide the obvious low cost advantage . scl vz vdd r2 2 c1 0.1uf 3 u1 mcu scl sda gnd vdd 4 +3.3v pwm sda u2 mlx90614bxx r1 1 smbus vss r2 u1 mlx90614bxx 4 1 2 scl vz u1 mlx90614bxx c4 cbus2 u1 mcu scl sda gnd vdd 1 i1 ipu1 c2 0.1uf scl vz 3 sda c3 cbus1 r1 3 scl 4 c1 0.1uf vss +3.3v i2 ipu2 vdd vdd 2 smbus vss current source or resistor pull-ups of the bus pwm sda pwm sda
mlx90616esf - hca infra red thermometer in to - 39 for high temperature thermometer guns 3901090616 page 30 of 36 data s heet rev 002 august 20, 2012 11.3 pwm output operation using the pwm ou tput mode of the mlx9061 6 is very simple, as shown in figure 22 . figure 22 : connection of mlx9061 6 for pwm output mode the pwm mode is free - running after por when configured in eeprom. the scl pin must be forced high for pwm mode operation (can be shorted to v dd pin) . a pull - up resistor can be used to preserve the option for smbus operation while having pwm as a default as is shown on figure 23 . figure 23 : pwm output with smbus available again, the pwm mode needs to be written as the por default in ee prom. then for pwm operation the scl line can be high impedance, forced high, or even not connected. the pull - up resistor r1 will ensure there is a high level on the scl pin and the pwm por default will be active. smbus is still available (for example C fo r further reconfiguration of the mlx 90616 , or sleep mode power management) as there are pull - up resistors on the smbus lines anyway. pwm can be configured as open drain nmos or a push - pull output. in the case of open drain external pull - up will be needed. this allows cheap level conversion to lower logic high voltage. internal pull - ups present in many mcus can also be used. j1 con1 pwm vdd gnd 2 0.1uf vdd u1 mlx90614 vss pwm sda 1 c1 scl vz 3 pwm sda 10k 3 1 vdd 2 r1 scl vz j1 con1 scl pwm/sda gnd vdd u1 mlx90614 vss 0.1uf c1
mlx90616esf - hca infra red thermometer in to - 39 for high temperature thermometer guns 3901090616 page 31 of 36 data s heet rev 002 august 20, 2012 11.4 thermal alert / thermostat figure 24 : thermal alert/thermostat applications of mlx 90616 the mlx 90616 can b e configured in eeprom to operate as a thermal relay. a non contact freezing or boiling prevention with 1 ma quiescent current can be built with two components only C the mlx 90616 and a capacitor. the pwm/sda pin can be programmed as a push - pull or open dr ain nmos, which can trigger an exte rnal device, such as a relay (refer to electrical specifications for load capability), buzzer, rf transmitter or a led. this feature allows very simple thermostats to be built without the need of any mcu and zero design o verhead required for firmware development . in conjunction with a mcu, this function can operate as a system alert that wakes up the mcu. both object temperature and sensor die temperature can also be read in this configuration. 12 application comments signifi cant contamination at the optical input side (sensor filter ) might cause unknown additional filtering/distortion of the optical signal and therefore result in unspecified errors. ir sensors are inherently susceptible to errors caused by thermal gradients . the re are physical reasons for these phenomena and, in spite of the careful design of the mlx9061 6 xxx, it is recommended not to subject the mlx9061 6 to heat transfer and especially transient conditions. upon power - up the mlx9061 6 passes embedded checking and calibration routines. during these routines the output is not defined and it is recommended to wait for the specified por time before reading the module. very slow power - up may cause the embedded por circuitry to trigger on inappropriate levels, resul ting in unspecified operation and this is not recommended. the mlx9061 6 xxx is designed and calibrated to operate as a non contact thermometer in settled conditions . using the thermometer in a very different way will result in unknown results. capacitive loading on a smbus can degrade the communication. some improvement is possible with use of current sources compared to resistors in pull - up circuitry. further improvement is possible with specialized commercially available bus accelerators. with the mlx906 1 6 xxx additional improvement is possible by increasing the pull - up current (decreasing the pull - up resistor values ) . input levels for smbus compatible mode have higher overall tolerance than the smbus specification, but the output low level is rather low e ven with the high - power smbus specification for pull - up currents. another opti o n might be to go for a slower communication (clock speed), as the mlx 90616 xxx im plements schmi t t triggers on it s inputs in smbus compatible mode and is therefore not really sens itive to rise time of the bus (it is more likely the rise time will be an issue than the fall time, as far as the smbus systems are open drain with pull - up). u2 ac line r1 3 c2 10uf c1 0.1uf u1 mcu scl sda gnd vdd 2 scl vz c* 2 scl vz u1 mlx90614axx u1 mlx90614bxx vss vdd 1 1 smbus r2 vdd 4 q1 4 1 +5v u1 mlx90614axx vdd vss +3.3v r1 c3 0.1uf scl vz 3 r2 +24v vss c1 0.1uf pwm sda pwm sda 3 4 pwm sda d1 alert dev ice + - 2
mlx90616esf - hca infra red thermometer in to - 39 for high temperature thermometer guns 3901090616 page 32 of 36 data s heet rev 002 august 20, 2012 for esd protection there are clamp diodes between the vss and vdd and each of the other pins. thi s means that the mlx 90616 might draw current from a bus in case the scl and/or sda is connected and the vdd is lower than the bus pull - ups voltage. a s leep mode is available in the mlx9061 6 bxx. this mode is entered and exited via the smbus compatible 2 - w ire communication. on the other hand, the extended functionality of the scl pin yields increased leakage current through that pin. as a result, this pin needs to be forced low in sleep mode and the pull - up on the scl line needs to be disabled in order to k eep the overall power drain in sleep mode really small. during sleep mode the sensor will not perform measurements . the pwm pin is not designed for direct drive of inductive loads (such as electro - magnetic relays). some driver s need to be implemented f or higher load, and auxiliary protection might be necessary even for light but inductive loading. it is possible to use the mlx9061 6 xxx in applications, powered directly from the ac line ( transformer less). in such cases it is very important not to forget that the metal package of the sensor is not isolated and therefore may be come connected to that line and have that electric potential present too. melexis can not be responsible for any application like this and highly recommends not using the mlx9061 6 xx x in that way. power dissipation within the package may affect performance in two ways: by heating the ambient sensitive element significantly beyond the actual ambient temperature, as well as by causing gradients over the package that will inherently c ause thermal gradient over the cap. loading the outputs also causes increased power dissipation. in case of using the mlx 906166 xx internal zener voltage feature, the regulating external transistor should also not cause heating of the to39 package. high ca pacitive load on a pwm line will result in significant charging currents from the power supply , bypass ing the capacitor and therefore caus ing emc, noise, level degradation and power dissipation problems. a simple option is adding a series resistor between the pwm/sda pin and the capacitive loaded line, in which case timing specifications have to be carefully reviewed. for example, with a pwm output that is set to 1.024 ms and the output format that is 11 bit, the time step is 0.5 s and a settling time of 2 s would introduce a 4 lsb error. power supply decoupling capacitor is needed as with most integrated circuits. mlx9061 6 is a mixed - signal device with sensors, small signal analog part, digital part and i/o circuitry. in order to keep the noise low power supply switching noise needs to be decoupled. high noise from external circuitry can also affect noise performance of the device. in many applications a 100nf smd ceramic capacitor close to the vdd and vss pins would be a good choice. it should be noted t hat not only the trace to the vdd pin needs to be short, but also the one to the vss pin. using mlx 90616 with short pins improves the effect of the power supply decoupling. severe noise can also be coupled within the package from the scl (in worst cases al so from the sda) pin. this issue can be solved by using pwm output. also the pwm output can pass additional filtering (at lower pwm frequency settings). with a simple lpf rc network added also an increase to the esd rating is possible. check www.melexis.com for most recent application notes about mlx9061 6 .
mlx90616esf - hca infra red thermometer in to - 39 for high temperature thermometer guns 3901090616 page 33 of 36 data s heet rev 002 august 20, 2012 13 standard information regarding manufacturability of melexis products with different soldering processes our products are classified and qualified regarding solde ring technology, solderability and moisture sensitivity level according to following test methods: wave soldering thds ( t hrough h ole d evices) ? eia/jedec jesd22 - b106 and en60749 - 15 resistance to soldering temperature for through - hole mounted devices iron soldering thds ( t hrough h ole d evices) ? en60749 - 15 resistance to soldering temperature for through - hole mounted devices solderability thds ( t hrough h ole d evices) ? eia/jedec jesd22 - b102 and en60749 - 21 solderability for all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed upon with melexis. melexis is contributing to global environmental co nservation by promoting lead free solutions. for more information on qualifications of rohs compliant products (rohs = european directive on the restriction of the use of certain hazardous substances) please visit the quality page on our website: http://www.melexis.com/quality.aspx the mlx9061 6 is rohs compliant 14 esd precautions electronic semiconductor products are sensitive to electro static discharge (esd). always observe electro static discharge contro l procedures whenever handling semiconductor products. 15 faq when i measure aluminum and plastic parts settled at the same conditions i get significant errors on aluminum . why? different materials have different emissivity . a typical value for aluminum (roug hly polished) is 0.18 and for plastics values of 0.840.95 are typical. ir thermometers use the radiation flux between the sensitive element in the sensor and the object of interest, given by the equation , where : 1 and 2 are the emissivities of the two objects, 1 is the absorptivity of the sensor (in this case), is the stefan - boltzmann constant, a 1 and a 2 are the surface areas involved in the radiation heat transfer, f a - b is the shape factor, t 1 and t 2 are kno wn temperature of the sensor die (measured with specially integrated and calibrated element) and the object temperature that we need. note that these are all in kelvin, heat exchange knows only physics. ? ? ? ? 2 4 2 2 b a 1 4 1 1 1 a t f a t q . . . . . . . . ? ? ? ? ? ? ? ?
mlx90616esf - hca infra red thermometer in to - 39 for high temperature thermometer guns 3901090616 page 34 of 36 data s heet rev 002 august 20, 2012 when a body with low emissivity (such as aluminum ) is involved in this heat transfer, the portion of the radiation incident to the sensor element that really comes from the object of interest decreases C and the reflected environmental ir emissions take place. (this is all for bodies with zero transparency i n the ir band.) the ir thermometer is calibrated to stay with in specified accuracy C but it has no way to separate the incoming ir radiation into real object and reflected environmental part. therefore, measuring objects with low emissivity is a very sophi sticated issue and infra - red measurements of such materials are a specialized field. what can be done to solve that problem? look at paintings C for example, oil paints are likely to have emissivity of 0.850.95 C but keep in mind that the stability of th e paint emissivity has inevitable impact on measurements. it is also a good point to keep in mind that not everything that looks black is black also for ir. for example, even heavily oxidized aluminum has still emissivity as low as 0.30. how high is enou gh? not an easy question C but, in all cases the closer you need to get to the real object temperature the higher the needed emissivity will be, of course. with the real life emissivit y values the environmental ir comes into play via the reflectivity of th e object (the sum of emissivity, reflectivity and absorptivity gives 1.00 for any material). the larger the difference between environmental and object temperature is at given reflectivity ( with a n opaque for ir material reflectivity equals 1.00 minus emis sivity ) the bigger errors it produces. after i put the mlx 90616 in the dashboard i start getting errors larger than specified despite that the module was working properly before that. why? any object present in the fov of the module provides ir signal. it is actually possible to introduce error in the measurements if the module is attached to the dashboard with an opening that enters the fov. in that case the portion of the dashboard opening in the fov will introduce ir signal in conjunction with constrain ing the effective fov and thus compromising specified accuracy. relevant opening that takes in account the fov is a must for accurate measurements. note that the basic fov specification takes 50% of ir signal as threshold (in order to define the area, wher e the measurements are relevant), while the entire fov at lower level is capable of introducing lateral ir signal under many conditions. when a hot (cold) air stream hits my mlx 90616 some error adds to the measured temperature i read. what is it? ir senso rs are inherently sensitive to difference in temperatures between the sensitive element and everything incident to that element. as a matter of fact, this element is not the sensor package, but the sensor die inside. therefore, a thermal gradient over the sensor package will inevitably result in additional ir flux between the sensor package and the sensor die. this is real optical signal that can not be segregated from the target ir signal and will add errors to the measured temperature. thermal gradients w ith impact of that kind are likely to appear during transient conditions. the sensor used is developed with care for its sensitivity to this kind of lateral phenomena, but the nature of the phenomena demands some care when choosing the place to use the mlx 90616 in order to make the effects negligible. i measure human body temperature and i often get measurements that significantly differ from the +37c i expect. ir measurements are true surface temperature measurements. in many applications this means tha t the actual temperature measured by an ir thermometer will be temperature of the clothing and not the skin temperature. emissivity (explained first in this section) is another issue with clothes that has to be considered. there is also the simple chance that the measured temperature is a ccurate C for example, in a cold winter the human hand can appear at temperatures quite different from the well known +37c. i consider using mlx 90616 aaa to measure temperature within car compartme nt, but i am embarrassed about the sun light that may hit the module. is it a significant issue? special care is taken to cut off the visible light spectra as well as the nir (near ir) before it reaches the sensitive sensor die. even more, the glass (in mo st cases) is not transparent to the ir radiation used by the mlx 90616 . glass has temperature and really high emissivity in most cases C it is black for ir of interest. overall, sun behind a window is most likely to introduce relatively small errors. why is it not completely eliminated after all? even visible light partially absorbed in the filter of the sensor has some heating potential and there is no way to make the sensor chip blind for that heating right in front of it.
mlx90616esf - hca infra red thermometer in to - 39 for high temperature thermometer guns 3901090616 page 35 of 36 data s heet rev 002 august 20, 2012 16 package information the ml x9061 6 is packaged in an industry standard to C 39 can . figure 25 : mlx9061 6 package note: all dimensions are in m m 16.1 part marking the mlx 90616 is laser marked with 10 symbols. first 3 letters define device version , and the last 7 are the lot number. example: hca 9307308 C mlx 90616 hca from lot 9307308.
mlx90616esf - hca infra red thermometer in to - 39 for high temperature thermometer guns 3901090616 page 36 of 36 data s heet rev 002 august 20, 2012 17 references [1] system management bus (smbus) specification version 2.0 august 3, 2000 sbs implementers forum copyright . 1994, 1995, 1998, 2000 duracell, inc., energizer power sys tems, inc., fujitsu, ltd., intel corporation, linear technology inc., maxim integrated products, mitsubishi electric semiconductor company, powersmart, inc., toshiba battery co. ltd., unitrode corporation, usar systems, inc. 18 disclaimer devices sold by mel exis are covered by the warranty and patent indemnification provisions appearing in its term of sale. melexis makes no warranty, express, statutory, implied, or by description regarding the info r mation set forth herein or regarding the freedom of the descr ibed devices from patent infringement. melexis reserves the right to change specifications and prices at any time and without notice. therefore, prior to d e signing this product into a system, it is necessary to check with melexis for current information. t his product is intended for use in normal commercial applications. applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life - support or life - sustaining equipment are specifically not recommended without additional processing by melexis for each application. the information furnished by melexis is believed to be correct and accurate. however, melexis shall not be liable to recipient or any third party for any damage s, including but not limited to personal injury, property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential da m ages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. no obligation or liability to recipient or any third party shall arise or flow out of melexis rendering of technical or other services. ? 2012 melexis nv. all rights reserved. for the latest version of this document, go to our website at www.melexis.com or for additional information contact melexis direct: europe, africa, asia: america: phone: +32 1367 0495 phone: +1 248 306 5400 e - mail: sales_europe@melexis.com e - mail: sales_usa@melexis.com iso/ts 16949 and iso14001 certified

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